Bhubaneswar: Global tech giants like Intel, Lockheed Martin and Applied Materials partnering with 3D Glass Solution to set up India’s first advanced semiconductor packaging unit in Odisha is a testament of the state’s growing trust worldwide, chief minister Mohan Charan Majhi said, while laying the foundation stone of the facility, here on Sunday.The Rs 1,943.5 crore project is expected to be completed by Aug 2028 with full-scale production targeted by Aug 2030. The unit will annually produce 70,000 glass panels, 50 million assembled units and 13,200 advanced 3DHI modules, the CM said, adding that it will provide 2,500 direct and indirect jobs.Majhi said Odisha has become the first choice for investors, highlighting the fact that more than Rs 10,000 crore has been invested in the state’s semiconductor sector so far. Companies like RIR Power Electronics and SiCSEM have already set up units in the state. “Odisha will play a key role in the visionary Atmanirbhar Bharat initiative of Prime Minister Narendra Modi. Odisha will be the launchpad for Atmanirbhar Bharat in eastern India,” Majhi said.Highlighting five reasons why Odisha is the first choice for investors, Majhi said it includes abundant natural resources, a world-class foundation, skilled youth, robust connectivity and responsive governance. Addressing the youth, he called it a golden opportunity for Odisha’s students and engineers. He urged them to skill themselves and advance in this emerging field.“We have resources, talent, infrastructure and determination. If you want to shape the future of technology, Odisha is your destination,” the CM said, while inviting investors.“With the launch of this project, Odisha is poised to become home to one of the world’s most sophisticated chip packaging technologies,” Union electronics and IT minister Ashwini Vaishnaw said.“Our efforts will continue to enrich Odisha industrially and develop it as an IT hub in the future. The glass substrate packaging unit by 3D Glass Solution will prove to be the future of the semiconductor industry,” the minister added.Vaishnaw said that two semiconductor projects have already been approved for Odisha under the India Semiconductor Mission, while three more electronics and semiconductor-related proposals are in the pipeline. “Discussions are also underway with major global companies, including Intel, for future investments in the state,” said Vaishnaw.Joining the event through video link, Intel CEO Lip-Bu Tan highlighted the significance of the project as a major step towards strengthening India’s semiconductor ecosystem and advancing global tech collaboration. The project will evolve into a centre of excellence, strengthening global supply chains and reinforcing India’s role in the semiconductor industry, Tan said.Among others, Odisha’s electronics and IT minister Mukesh Mahaling, chief secretary Anu Garg, president and CEO of 3D Glass Solution, Babu Mandava attended the function.
